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product structure silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays . 1/37 tsz02201-0r2r0g100050-1-2 18.may.2016 rev.007 ?2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 14 ? 001 serial eeprom series standard eeprom i 2 c bus eeprom (2-wire) br24g32-3a general description br24g32 - 3a is a 32kbit serial eeprom of i 2 c bus interface method features ? all controls available by 2 ports of serial clock(scl) and serial data(sda) ? other devices than eeprom can be connected to the same port, saving microcontroller port ? 1.7v to 5.5v single power source operation most suitable for battery use ? 1.7v to 5.5v wide limit of operating voltage, possible fast mode 1mhz operation ? up to 32 byte in page write mode ? bit format 4k x 8 ? self-timed programming cycle ? low current consumption ? prevention of write mistake ? write (write protect) function added ? prevention of write mistake at low voltage ? more than 1 million write cycles ? more than 40 years data retention ? noise filter built in scl / sda terminal ? initial delivery state ffh packages w(typ) x d(typ) x h(max) figure 1. msop8 2.90mm x 4.00mm x 0.90mm sop-j8 4.90mm x 6.00mm x 1.65mm sop8 5.00mm x 6.20mm x 1.71mm dip-t8 9.30mm x 6.50mm x 7.10mm ssop-b8 3.00mm x 6.40mm x 1.35mm tssop-b8 3.00mm x 6.40mm x 1.20mm tssop-b8j 3.00mm x 4.90mm x 1.10mm v son008x2030 2.00mm x 3.00mm x 0.60mm sop- j8m 4.90mm x 6.00mm x 1.80mm tssop-b8m 3.00mm x 6.40mm x 1.10mm datashee t downloaded from: http:///
2/37 datasheet d a t a s h e e t br24g32-3a ?2014 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 tsz02201-0r2r0g100050-1-2 18.may.2016 rev.007 absolute maximum ratings (ta=25 ) parameter symbol rating unit remark supply voltage v cc -0.3 to +6.5 v permissible dissipation pd 0.45 (sop8) w derate by 4.5mw/c when operating above ta=25c 0.45 (sop-j8m) derate by 4.5mw/c when operating above ta=25c 0.45 (sop-j8) derate by 4.5mw/c when operating above ta=25c 0.30 (ssop-b8) derate by 3.0mw/c when operating above ta=25c 0.33 (tssop-b8) derate by 3.3mw/c when operating above ta=25c 0.33 (tssop-b8m) derate by 3.3mw/c when operating above ta=25c 0.31 (tssop-b8j) derate by 3.1mw/c when operating above ta=25c 0.31 (msop8) derate by 3.1mw/c when operating above ta=25c 0.30 (vson008x2030) derate by 3.0mw/c when operating above ta=25c 0.80 (dip-t8) derate by 8.0mw/c when operating above ta=25c storage temperature tstg -65 to +150 operating temperature topr -40 to +85 input voltage / output voltage \ -0.3 to v cc +1.0 v the max value of input voltage/out put voltage is not over 6.5v. when the pulse width is 50ns or less, the min value of input voltage/output voltage is not lower than -1.0v. junction temperature tjmax 150 junction temperature at the storage condition electrostatic discharge voltage (human body model) v esd -4000 to +4000 v memory cell characteristics (ta=25 , vcc=1.7v to 5.5v) parameter limit unit min typ max write cycles ( 1 ) 1,000,000 - - times data retention (1) 40 - - years (1) not 100% tested recommended operating ratings parameter symbol rating unit power source voltage v cc 1.7 to 5.5 v input voltage v in 0 to v cc dc characteristics (unless otherwise specified, ta=-40 to +85 , vcc =1.7v to 5.5v) parameter symbol limit unit conditions min typ max input high voltage 1 v ih1 0.7 v cc - v cc +1.0 v input low voltage 1 v il1 -0.3 (2) - +0.3 v cc v output low voltage 1 v ol1 - - 0.4 v i ol =3.0ma, 2.5v v cc 5.5v (sda) output low voltage 2 v ol2 - - 0.2 v i ol =0.7ma, 1.7v v cc 2.5v (sda) input leakage current i li -1 - +1 a v in =0 to v cc output leakage current i lo -1 - +1 a v out =0 to v cc (sda) supply current (write) i cc1 - - 2.5 ma v cc =5.5v,f scl =1mhz, t wr =5ms, byte write, page write supply current (read) i cc2 - - 2.0 vcc=5.5v,f scl =1mhz random read, current read, sequential read standby current i sb - - 2.0 a vcc=5.5v, sda, scl=vcc a0, a1, a2=gnd,wp=gnd (2) when the pulse width is 50ns or less, it is -1.0v. downloaded from: http:///
3/37 datasheet d a t a s h e e t br24g32-3a ?2014 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 tsz02201-0r2r0g100050-1-2 18.may.2016 rev.007 ac characteristics (unless otherwise specified, ta=-40 to +85 , v cc =1.7v to 5.5v) parameter symbol limit unit min typ max clock frequency f scl - - 1000 khz data clock high period t high 0.30 - - s data clock low period t low 0.5 - - s sda, scl (input) rise time (1) t r - - 0.12 s sda, scl (input) fall time (1) t f1 - - 0.12 s sda (output) fall time (1) t f2 - - 0.12 s start condition hold time t hd:sta 0.25 - - s start condition setup time t su:sta 0.20 - - s input data hold time t hd:dat 0 - - ns input data setup time t su:dat 50 - - ns output data delay time t pd 0.05 - 0.45 s output data dold time t dh 0.05 - - s stop condition setup time t su:sto 0.25 - - s bus free time t buf 0.5 - - s write cycle time t wr - - 5 ms noise spike width (sda, scl) t i - - 0.05 s wp hold time t hd:wp 1.0 - - s wp setup time t su:wp 0.1 - - s wp high period t high:wp 1.0 - - s (1) not 100% tested ac characteristics condition parameter symbol conditions unit load capacitance c l 100 pf sda, scl (input) rise time t r 20 ns sda, scl (input) fall time t f1 20 ns input data level v il1 /v ih1 0.2vcc/0.8vcc v input/output data timing reference level - 0.3vcc/0.7vcc v downloaded from: http:///
4/37 datasheet d a t a s h e e t br24g32-3a ?2014 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 tsz02201-0r2r0g100050-1-2 18.may.2016 rev.007 serial input / output timing figure 2-(e). wp timing at write cancel figure 2-(d). wp timing at write execution figure 2-(c). write cycle timing figure 2-(b). start-stop bit timing figure 2-(a). serial input / output timing input read at the rise edge of scl data output in sync with the fall of scl scl sda ( ) sda ( ) tr tf1 thigh tsu:dat tlow thd:dat tdh tpd tbuf thd:sta 70% 30% 70% 70% 30% 70% 70% 30% 30% 70% 70% 30% 70% 70% 70% 70% 30% 30% 30% 30% tf2 70% 70% tsu:sta thd:sta tat t tsu:sto t t 30% 30% 70% 70% d0 ack twr (n-th address) tat t t t 70% 70% data(1) d0 ack d1 data(n) ack twr 30% 70% t t thd:wp tsu:wp 30% 70% data(1) d0 d1 ack data(n) ack thigh:wp 70% 70% twr 70% (input) (output) downloaded from: http:///
5/37 datasheet d a t a s h e e t br24g32-3a ?2014 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 tsz02201-0r2r0g100050-1-2 18.may.2016 rev.007 block diagram figure 3. block diagram pin configuration (top view) pin descriptions terminal name input/ output descriptions br24g32-3a a0 input slave address setting* a1 input slave address setting* a2 input slave address setting* gnd - reference voltage of all input / output, 0v sda input/ output serial data input serial data output scl input serial clock input wp input write protect terminal vcc - connect the power source. *a0,a1 and a2 are not allowed to use as open. 1 1 1 2 1 3 1 4 1 1 6 1 5 br24g32-3a a0 1 7 a1 a2 gnd vcc wp scl 8 sda 8 7 6 5 4 3 2 1 sda scl wp v cc gnd a 2 a 1 a 0 a ddress decoder word a ddress register data register control circuit high voltage generating circuit power source voltage detection 8bit a ck start stop 32kbit eeprom array 12bit downloaded from: http:///
6/37 datasheet d a t a s h e e t br24g32-3a ?2014 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 tsz02201-0r2r0g100050-1-2 18.may.2016 rev.007 typical performance curves figure 4. input high voltage1 vs supply voltage (a0,a1,a2,scl,sda,wp) figure 5. input low voltage1 vs supply voltage (a0, a1, a2, scl, sda, wp) figure 6. output low voltage1 vs output low current (v cc =2.5v) figure 7. output low voltage2 vs output low current (v cc =1.7v) 0 1 2 3 4 5 6 0123456 supply voltage : vcc(v) input low voltage : v il1 (v) ta=-40 ta= 25 ta= 85 spec 0 1 2 3 4 5 6 0123456 supply voltage : vcc(v) iinput high voltage : v ih1 (v) ta=-40 ta= 25 ta= 85 spec 0 0.2 0.4 0.6 0.8 1 0123456 output low current : i ol (ma) output low voltage : v ol1 (v) spec ta=-40 ta= 25 ta= 85 0 0.2 0.4 0.6 0.8 1 0123456 output low current : i ol (ma) output low voltage : v ol2 (v) ta=-40 ta= 25 ta= 85 spec downloaded from: http:///
7/37 datasheet d a t a s h e e t br24g32-3a ?2014 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 tsz02201-0r2r0g100050-1-2 18.may.2016 rev.007 typical performance curves \ continued figure 8. input leakage current vs supply voltage (a0,a1,a2,scl,wp) figure 9. output leakage current vs supply voltage (sda) figure 10. supply current (write) vs supply voltage (f scl =1mhz) figure 11. supply current (read) vs supply voltage (f scl =1mhz) 0 0.2 0.4 0.6 0.8 1 1.2 0123456 supply voltage : vcc(v) input leakage current : i li (a) ta=-40 ta= 25 ta= 85 spec 0 0.2 0.4 0.6 0.8 1 1.2 0123456 supply voltage : vcc(v) output leakage current : i lo (a) ta=-40 ta= 25 ta= 85 spec 0 0.5 1 1.5 2 2.5 3 0123456 supply voltage : vcc(v) supply current (write) : icc1(ma) ta=-40 ta= 25 ta= 85 spec 0 0.5 1 1.5 2 2.5 0123456 supply voltage : vcc(v) supply current (read) : i cc2 (ma) t= t= t= downloaded from: http:///
8/37 datasheet d a t a s h e e t br24g32-3a ?2014 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 tsz02201-0r2r0g100050-1-2 18.may.2016 rev.007 typical performance curves \ continued figure 12. standby current vs supply voltage figure 13. clock frequency vs supply voltage figure 14. data clock high period vs supply voltage figure 15. data clock low period vs supply voltage 0.1 1 10 100 1000 10000 0123456 supply voltage : vcc(v) clock frequency : fscl(khz) t= t= t= 0 0.1 0.2 0.3 0.4 0123456 supply voltage : vcc(v) data clock high period : t high (s) t= t= t= 0 0.1 0.2 0.3 0.4 0.5 0.6 supply voltage : vcc(v) data clock low period : t low (s) t= t= t= 0 0.5 1 1.5 2 2.5 0123456 supply voltage : vcc(v) standby current : i sb (a) t= t= t= downloaded from: http:///
9/37 datasheet d a t a s h e e t br24g32-3a ?2014 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 tsz02201-0r2r0g100050-1-2 18.may.2016 rev.007 typical performance curves \ continued figure 17. start condition hold time vs supply voltage figure 16. sda (output) fall time vs supply voltage figure 18. start condition setup time vs supply voltage 0 0.05 0.1 0.15 0.2 0.25 0.3 supply voltage : vcc(v) start condition hold time : t hd:sta (s) t= t= t= 0 0.02 0.04 0.06 0.08 0.1 0.12 0.14 supply voltage : vcc(v) sda (output) fall time : t f2 (s) t= t= t= 0 0.05 0.1 0.15 0.2 0.25 0.3 0123456 supply voltage : vcc(v) start condition setup time : t su:sta (s) t= t= t= figure 19. input data hold time vs supply voltage (high) -150 -100 -50 0 50 0123456 supply voltage: vcc(v) input data hold time : t hd:dat (ns) t= t= t= downloaded from: http:///
10/37 datasheet d a t a s h e e t br24g32-3a ?2014 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 tsz02201-0r2r0g100050-1-2 18.may.2016 rev.007 typical performance curves \ continued -150 -100 -50 0 50 0123456 supply voltage : vcc(v) input data hold time : t hd:dat (ns) t= t= t= 0 10 20 30 40 50 60 0123456 supply voltage : vcc(v) input data setup time : t su:dat (ns) t= t= t= 0 10 20 30 40 50 60 0123456 supply voltage : vcc(v) input data setup time : t su:dat (ns) t= t= t= 0 0.1 0.2 0.3 0.4 0.5 0123456 supply voltage : vcc(v) output data delay time : t pd0 (s) t= t= t= figure 20. input data hold time vs supply voltage (low) figure 21. input data setup time vs supply voltage (high) figure 22. input data setup time vs supply voltage (low) figure 23. output data delay time vs supply voltage downloaded from: http:///
11/37 datasheet d a t a s h e e t br24g32-3a ?2014 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 tsz02201-0r2r0g100050-1-2 18.may.2016 rev.007 typical performance curves \ continued 0 0.1 0.2 0.3 0.4 0.5 0123456 supply voltage : vcc(v) output data delay time : t pd1 (s) t= t= t= 0 0.05 0.1 0.15 0.2 0.25 0.3 0123456 supply voltage : vcc(v) stop condition setup time : t su:sto (s) t= t= t= 0 0.1 0.2 0.3 0.4 0.5 0.6 su p p l y vo l ta g e : vcc(v) bus free time : t buf (s) t= t= t= 0 1 2 3 4 5 6 0123456 su p p l y vo l ta g e : vcc(v) write cycle time : t wr (ms) ta=-40 ta= 25 ta= 85 spec figure 26. bus free time vs supply voltage figure 24. output data delay time vs supply voltage figure 25. stop condition setup time vs supply voltage figure 27. write cycle time vs supply voltage downloaded from: http:///
12/37 datasheet d a t a s h e e t br24g32-3a ?2014 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 tsz02201-0r2r0g100050-1-2 18.may.2016 rev.007 figure 31. noise spike width vs supply voltage (sda low) figure 30. noise spike width vs supply voltage (sda high) figure 29. noise spike width vs supply voltage (scl low) figure 28. noise spike width vs supply voltage (scl high) typical performance curves \ continued 0 0.05 0.1 0.15 0.2 0.25 0.3 0123456 supply voltage : vcc(v) noise spike width(scl low) : ti(s) t= t= t= 0 0.05 0.1 0.15 0.2 0.25 0.3 0123456 supply voltage : vcc(v) noise spike width(scl high) : ti(s) t= t= t= 0 0.05 0.1 0.15 0.2 0.25 0.3 0123456 supply voltage : vcc(v) noise spike widthi(sda low) : t(s) t= t= t= 0 0.05 0.1 0.15 0.2 0.25 0.3 0123456 supply voltage : vcc(v) noise spike width(sda high) : t i (s) t= t= t= downloaded from: http:///
13/37 datasheet d a t a s h e e t br24g32-3a ?2014 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 tsz02201-0r2r0g100050-1-2 18.may.2016 rev.007 figure 34. wp high period vs supply voltage figure 33. wp setup time vs supply voltage figure 32. wp hold time vs supply voltage typical performance curves \ continued 0 0.2 0.4 0.6 0.8 1 1.2 0123456 supply voltage : vcc(v) wp hold time : t hd:wp (s) t= t= t= -0.3 -0.2 -0.1 0 0.1 0.2 0123456 supply voltage : vcc(v) wp setup time : t su:wp (s) t= t= t= 0 0.2 0.4 0.6 0.8 1 1.2 supply voltage : vcc(v) wp high period : t high:wp ( s) t= t= t= downloaded from: http:///
14/37 datasheet d a t a s h e e t br24g32-3a ?2014 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 tsz02201-0r2r0g100050-1-2 18.may.2016 rev.007 timing chart 1. i 2 c bus data communication i 2 c bus data communication starts by start condition input, and en ds by stop condition input. data is always 8bit long, and acknowledge is always required after each byte. i 2 c bus data communication with se veral devices is possible by connecting with 2 communication lines: serial data (sda) and serial clock (scl). among the devices, there should be a master that generates clock and control communication start and end. the rest become slave which are controlled by an address peculiar to each device, like this eeprom. the device that outputs data to the bus during data communication is called transmitter, and the device that receives data is called receiver. 2. start condition (start bit recognition) (1) before executing each command, start condition (start bi t) where sda goes from 'high' down to 'low' when scl is 'high' is necessary. (2) this ic always detects whether sda and scl are in start c ondition (start bit) or not, ther efore, unless this condition is satisfied, any command cannot be executed. 3. stop condition (stop bit recognition) (1) each command can be ended by a stop condition (stop bit) where sda goes from 'low' to 'high' while scl is 'high'. 4. acknowledge (ack) signal (1) this acknowledge (ack) signal is a software rule to show whether data transfer has been made normally or not. in master-slave communication, the device (ex. -com sends slave address input for write or read command to this ic) at the transmitter (sending) side releas es the bus after output of 8bit data. (2) the device (ex. this ic receives the slave address input for write or read command from the -com) at the receiver (receiving) side sets sda 'low' during 9 th clock cycle, and outputs acknowledge signal (ack signal) showing that it has received the 8bit data. (3) this ic, after recognizing start condition and slave address (8bit), outputs acknowledge signal (ack signal) 'low'. (4) after receiving 8bit data (word address and write data) during each write operation, this ic outputs acknowledge signal (ack signal) 'low'. (5) during read operation, this ic outputs 8bit data (read data) and detects acknowledge signal (ack signal) 'low'. when acknowledge signal (ack signal) is detected, and stop condition is not sent from the master ( -com) side, this ic continues to output data. when acknowledge signal (a ck signal) is not detected, this ic stops data transfer, recognizes stop condition (stop bit), and ends read operation. then this ic becomes ready for another trasmission. 5. device addressing (1) slave address comes after start condition from master. (2) the significant 4 bits of slave address are used for recognizing a device type. (3) the device code of this ic is fixed to '1010'. (4) next slave addresses (a2 a1 a0 --- device address) ar e for selecting devices, and plural ones can be used on a same bus according to the number of device addresses. (5) the most insignificant bit (r/w --- read/write) of slav e address is used for designating write or read operation, and is as shown below. setting r / w DD to 0 ------- write (setting 0 to word address setting of random read) setting r / w DD to 1 ------- read type slave address maximum number of connected buses br24g32-3a 1 0 1 0 a2 a1 a0 r/ w DD 8 a t a ata ata a tat a a figure 35. data transfer timing downloaded from: http:///
15/37 datasheet d a t a s h e e t br24g32-3a ?2014 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 tsz02201-0r2r0g100050-1-2 18.may.2016 rev.007 write command 1. write cycle (1) arbitrary data can be written to eeprom. when writin g only 1 byte, byte write is normally used, and when writing continuous data of 2 bytes or more, simultaneous write is possible by page write cycle. the maximum number of bytes is specified per device of each ca pacity. up to 32 arbitrary bytes can be written. (2) during internal write execution, all input commands are ignored, theref ore ack is not returned. (3) data is written to the address designated by word address (n-th address) (4) by issuing stop bit after 8bit data input, internal write to memory cell starts. (5) when internal write is started, command is not accepted for t wr (5ms at maximum). (6) using page write cycle, writing in bulk is done as fo llows: when data of more than 32 bytes is sent, the bytes in excess overwrite the data already sent first. (refer to "internal address increment") (7) as for page write cycle of br24g32-3a, where 2 or mo re bytes of data is intended to be written, after the 7 significant bits of word address are designated arbitrarily, only the value of 5 least significant bits in the address is incremented internally, so that data up to 32 bytes of memory only can be written. a1 a2 wa 14 1 1 0 0 w r i t e s t a r t r / w s t o p 1st word address data slave address a0 d0 a c k sda line a c k a c k wa 0 a c k 2nd word address d7 *1 wa 15 wa 13 wa 12 wa 11 *1 wa12 to wa15 become don't care. figure 36. byte write cycle figure 37. page write cycle *1 wa12 to wa15 become don't care. w r i t e s t a r t r / w a c k s t o p 1st word a ddress(n) sda line a c k a c k data(n+31) a c k slave a ddress 1 0 0 0 1 0 a 0 a 1 a 2 wa 14 d0 *1 data(n) d0 d7 a c k 2nd word a ddress(n) wa 0 wa 15 wa 13 wa 12 wa 11 downloaded from: http:///
16/37 datasheet d a t a s h e e t br24g32-3a ?2014 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 tsz02201-0r2r0g100050-1-2 18.may.2016 rev.007 2. notes on write cycle continuous input list of numbers of page write number of pages 32 bytes product number br24g32-3a the above numbers are maximum bytes for respective types. any bytes below these can be written. in the case br24g32-3a, 1 page=32 bytes, but the page writ e cycle time is 5ms at maximum for 32byte bulk write. it does not stand 5ms at maximum 32byte=160ms (max). 3. internal address increment page write mode 4. write protect (wp) terminal write protect (wp) function when wp terminal is set at v cc (h level), data rewrite of all addresses is prohibited. when it is set gnd (l level), data rewrite of all address is enabled. be sure to connect this terminal to vcc or gnd, or control it to h level or l level. do not leave it open. in case of using it as rom, it is recommended to connect it to pull up or vcc. at extremely low voltage at power on/off, by setting the wp terminal h, write error can be prevented. for example, when it is started from address 1eh, then, increment is made as below, 1eh 1fh 00h 01h ??? please take note. 1eh ??? 1e in hexadecimal, therefore, 00011110 becomes a binary number. aaaaaaaa downloaded from: http:///
17/37 datasheet d a t a s h e e t br24g32-3a ?2014 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 tsz02201-0r2r0g100050-1-2 18.may.2016 rev.007 read command 1. read cycle read cycle is when data of eeprom is read. read cycle c ould be random read cycle or current read cycle. random read cycle is a command to read data by designating a specific address, and is used generall y. current read cycle is a command to read data of internal address register without desi gnating an address, and is used when to verify just after write cycle. in both the read cycles, sequential read cycle is available where the next address data can be read in succession. (1) in random read cycle, data of designated word address can be read. (2) when the command just before current read cycle is r andom read cycle, current read cycle (each including sequential read cycle), data of incremented last read addr ess (n)-th, i.e., data of the (n+1)-th address is output. (3) when ack signal 'low' after d0 is detected, and stop condition is not sent from master ( -com) side, the next address data can be read in succession. (4) read cycle is ended by stop condition where 'h' is input to ack signal after d0 and sda signal goes from l to h while scl signal is 'h'. (5) when 'h' is not input to ack signal after d0, sequential read gets in, and the next data is output. therefore, read command cycle cannot be ended. to end read command cycle, be sure to input 'h' to ack signal after d0, and the stop condition where sda goes from l to h while scl signal is 'h'. (6) sequential read is ended by stop condition where 'h' is input to ack signal after arbitrary d0 and sda is asserted from l to h while scl signal is 'h'. t t a t a t a a a a ata a a a a a a a a a t a t a a a a a a a a a a a figure 38. random read cycle *1 wa12 to wa15 become dont care. s t a r t s t o p sda line a c k data(n) a c k slave address 10 0 1 a0 a1 a2 d0 d7 r / w r e a d fi g ure 39. current read c y cle a t a t a t ata a a a ata a a a a a a figure 40. sequential read cycle (in the case of current read cycle) downloaded from: http:///
18/37 datasheet d a t a s h e e t br24g32-3a ?2014 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 tsz02201-0r2r0g100050-1-2 18.may.2016 rev.007 software reset software reset is executed to avoid malfunction after po wer on, and during command input. software reset has several kinds, and 3 kinds of them are shown in t he figure below. (refer to figure 41-(a), figure 41-(b), figure 41-(c).) within the dummy clock input area, the sda bus is released ('h' by pu ll up) and ack output and read data '0' (both 'l' level) may be output from eeprom. therefore, if 'h' is input forcibly, output may conflict and over current may flow, leading to instantaneous power failure of system power source or influence upon devices. acknowledge polling during internal write execution, all in put commands are ignored, therefore ack is not returned. during internal automatic write execution after write cycle input, next command (slave addre ss) is sent. if the first ack signal sends back 'l', then it means end of write operation, else 'h' is returned, which m eans writing is still in progress. by the use of acknowledge polling, next command can be executed without waiting for t wr = 5ms. to write continuously, r/w = 0, then to ca rry out current read cycle after write, sl ave address with r/w = 1 is sent, and if ack signal sends back 'l', then execute word address input and data output and so forth. 1 2 13 14 scl dummy clock14 start2 scl figure 41-(a). the case of dummy clock 14 +start+start+ command input start command from start input. 2 1 8 9 dummy clock 9 start figure 41-(b). the case of start + dummy clock 9 +start+ command input start normal command normal command normal command normal command start 9 sda sda scl sd 1 2 3 8 9 7 figure 41-(c). start9+ command input normal command normal command sda slave address word address s t a r t first write command a c k h a c k l slave address slave address slave address data write command during internal write, ack = high is returned. after completion of internal write, ack=low is returned, so input next word address and data in succession. t wr t wr second write command s t a r t s t a r t s t a r t s t a r t s t o p s t o p a c k h a c k h a c k l a c k l figure 42. case of continuous write by acknowledge polling downloaded from: http:///
19/37 datasheet d a t a s h e e t br24g32-3a ?2014 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 tsz02201-0r2r0g100050-1-2 18.may.2016 rev.007 wp valid timing (write cancel) wp is usually fixed to 'h' or 'l', but when wp is used to canc el write cycle and so on, pay attention to the following wp valid timing. during write cycle execution, inside cancel valid area, by setting wp='h', write cycle can be cancelled. in both byte write cycle and page write cycle, the area from the first start condition of command to the rise of clock to take in d0 of data(in page write cycle, the first byte data) is the cancel invalid area. wp input in this area becomes don't care. the area from the rise of scl to take in d0 to the stop condition input is the cancel valid area. furthermore, after the execution of forced end by wp, the ic enters standby status. command cancel by start condition and stop condition during command input, by continuously inputting start conditi on and stop condition, command can be cancelled. (figure 44.) however, within ack output area and during data read, sda bus may output 'l'. in this case, start condition and stop condition cannot be input, so reset is not available. theref ore, execute software reset. when command is cancelled by start-stop condition during random read cycle, sequential read cycle, or current read cycle, internal setting address is not determined. therefore, it is not possible to carry out current read cycle in succession. to carry out read cycle in succession, carry out random read cycle. ? rise of d0 taken clock scl d0 ack enlarged view scl sda ack d0 ? rise of sda sda wp wp cancel invalid area wp cancel valid area data is not written. figure 43. wp valid timing slave address d7 d6 d5 d4 d3 d2 d1 d0 data t wr sda d1 s t a r t a c k l a c k l a c k l a c k l s t o p word address figure 44. case of cancel by start, stop condition during slave address input scl sda 1 1 0 0 start condition stop condition enlarged view wp cancel invalid area downloaded from: http:///
20/37 datasheet d a t a s h e e t br24g32-3a ?2014 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 tsz02201-0r2r0g100050-1-2 18.may.2016 rev.007 i/o peripheral circuit 1. pull-up resistance of sda terminal sda is nmos open drain, so it requires a pu ll up resistor. as for this resistor value (r pu ), select an appropriate value from microcontroller v il , i l , and v ol -i ol characteristics of this ic. if r pu is large, operating fr equency is limited. the smaller the r pu , the larger is the supply current (read). 2. maximum value of r pu the maximum value of r pu is determined by the following factors. (1) sda rise time to be determined by the capacitance (c bus ) of bus line and r pu of sda should be t r or lower. furthermore, ac timing shou ld be satisfied even when sda rise time is slow. (2) the bus electric potential a to be determined by input current leak total (i l ) of the device connected to the bus with output of 'h' to sda line and r pu should sufficiently secure the input 'h' level (v ih ) of microcontroller and eeprom including recommended noise margin of 0.2v cc . v cc - i l r pu - 0.2 v cc v ih r pu 0.8v cc v ih i l ex.) v cc =3v i l =10 a v ih =0.7 v cc from (2) 30 [k ? ] r pu 0.83 0.73 1010 -6 3. minimum value of r pu the minimum value of r pu is determined by the following factors. (1) when ic outputs low, it should be satisfied that v olmax =0.4v and i olmax =3ma. (2) v olmax =0.4v should secure the input 'l' level (v il ) of microcontroller and eeprom including recommended noise margin 0.1v cc . v olmax v il -0.1 v cc ex.) v cc =3v, v ol =0.4v, i ol =3ma, microcontroller, eeprom v il =0.3v cc and v ol =0.4 [v] v il =0.3 3 =0.9 [v] therefore, the conditi on (2) is satisfied. 4. pull-up resistance of scl terminal when scl control is made at the cmos output port, there is no need for a pull up re sistor. but when there is a time where scl becomes 'hi-z', add a pull up resistor. as for the pull up resistor value, one of several k ? to several ten k ? is recommended in consideration of drive per formance of output port of microcontroller. i ol r pu v cc v ol i ol v cc v o l r pu 867 [ ? ] r pu 3 0.4 310 from (1) microcontroller r pu a sda terminal i l i l bus line capacity c bus figure 45. i/o circuit diagram br24gxx downloaded from: http:///
21/37 datasheet d a t a s h e e t br24g32-3a ?2014 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 tsz02201-0r2r0g100050-1-2 18.may.2016 rev.007 cautions on microcontroller connection 1. r s in i 2 c bus, it is recommended that sda port is of open drain input/output. howeve r, when using cmos input / output of tri state to sda port, insert a series resistance r s between the pull up resistor r pu and the sda terminal of eeprom. this is to control over curr ent that may occur when pmos of t he microcontroller and nmos of eeprom are turned on simultaneously. r s also plays the role of protecting the sd a terminal against surge. therefore, even when sda port is open drain input/output, r s can be used. 2. maximum value of r s the maximum value of r s is determined by the following relations. (1) sda rise time to be determined by the capacitance (c bus ) of bus line and r pu of sda should be t r or lower. furthermore, ac timing should be satisfied even when sda rise time is slow. (2) the bus electric potential a to be determined by r pu and r s the moment when eeprom outputs 'l' to sda bus should sufficiently secure the input 'l' level (v il ) of microcontroller including recommended noise margin of 0.1v cc . 3. minimum value of r s the minimum value of r s is determined by over current at bus collisio n. when over current flows, noises in power source line and instantaneous power failure of power source may occur. when allowable over current is defined as i, the following relation must be satisfied. determine the allowable current in considerati on of the impedance of power source line in set and so forth. set the over current to eeprom at 10ma or lower. r pu microcontroller r s eeprom figure 46. i/o circuit diagram figure 47. input / output collision timing a ck 'l' output of eeprom 'h' output of microcontroller over current flows to sda line by 'h' output of microcontroller and 'l' output of eeprom. scl sda microcontroller eeprom 'l'output r s r pu 'h' output over current i figure 49. i/o circuit diagram r pu micro controller r s eeprom i ol a bus line capacity c bus v ol v cc v il figure 48. i/o circuit diagram v cc r s v cc i 300 [ ? ] ex.) v cc =3v, i=10ma r s 3 1010 -3 i r s 1.67 k ? ? 0.33 0.4 0.13 2010 3 1.13 0.33 r s r pu 1.1v cc -v il ex. v cc =3v v il =0.3v cc v ol =0.4v r pu =20k r s v il v ol 0.1v cc (v cc v ol )r s +v ol +0.1v cc v il r pu +r s downloaded from: http:///
22/37 datasheet d a t a s h e e t br24g32-3a ?2014 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 tsz02201-0r2r0g100050-1-2 18.may.2016 rev.007 i/o equivalence circuit 1. input (a0, a1, a2, scl, wp) 2. input / output (sda) power-up/down conditions at power on, the ics internal circuits may go through unstabl e low voltage area as the vcc rises, making the ics internal logic circuit not completely reset, hence, malfunction may occur. to prevent this, the ic is equipped with por circuit and lvcc circuit. to assure the operation, obser ve the following conditions at power on. 1. set sda = 'h' and scl ='l' or 'h 2. start power source so as to satisfy the recommended conditions of t r , t off , and v bot for operating por circuit. t off t r v bot 0 v cc 3. set sda and scl so as not to become 'hi-z'. when the above conditions 1 and 2 cannot be obs erved, take the following countermeasures. (1) in the case when the above condition 1 cannot be observed such that sda becomes 'l' at power on. control scl and sda as shown below, to make scl and sda, 'h' and 'h'. (2) in the case when the above condition 2 cannot be observed. after power source becomes stable, execute software reset(page 18). (3) in the case when the above conditions 1 and 2 cannot be observed. carry out (1), and then carry out (2). low voltage malfunction prevention function lvcc circuit prevents data rewrite operation at low power, and prevents write error. at lvcc voltage (typ=1.2v) or below, data rewrite is prevented. noise countermeasures 1. bypass capacitor when noise or surge gets in the power source line, malfunction may occur, therefore, it is recommended to connect a bypass capacitor (0.1 f) between the ics v cc and gnd pins. connect the capacitor as close to the ic as possible. in addition, it is also recommended to connect a bypass capacitor between boards v cc and gnd. figure 52. rise waveform diagram t low t su:dat t dh a fter vcc becomes stable scl v cc sda fi g ure 53. = a= t su:dat a fter vcc becomes stable fi g ure 54. = a= figure 50. input pin circuit diagram figure 51. input / output pin circuit diagram recommended conditions of t r , t off ,v bo t t r t off v bo t 10ms or below 10ms or larger 0.3v or below 100ms or belo w 10ms or larger 0.2v or below downloaded from: http:///
23/37 datasheet d a t a s h e e t br24g32-3a ?2014 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 tsz02201-0r2r0g100050-1-2 18.may.2016 rev.007 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ics power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital bloc k from affecting the analog block. furthermore, connect a capacitor to ground at all po wer supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the refe rence point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground trac es of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceed ed the rise in temperature of the chip may result in deterioration of the properties of the ch ip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy b oard. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expect ed characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give s pecial consideration to power coupling capacitance, power wiring, width of ground wiri ng, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always dischar ge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assemb ly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pc b. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. downloaded from: http:///
24/37 datasheet d a t a s h e e t br24g32-3a ?2014 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 tsz02201-0r2r0g100050-1-2 18.may.2016 rev.007 operational notes C continued 11. unused input pins input pins of an ic are of ten connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unc onnected, the electric field from th e outside can easily charge it. the small charge acquired in this way is enough to produce a signifi cant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused in put pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic in the construction of this ic, p-n junctions are inevit ably formed creating parasitic diodes or transistors. the operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions which c ause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. fu rthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the ic. even if the power supply voltage is applied, make sure that the input pins have voltages within the values specified in the electrical characteristics of this ic. downloaded from: http:///
25/37 datasheet d a t a s h e e t br24g32-3a ?2014 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 tsz02201-0r2r0g100050-1-2 18.may.2016 rev.007 part numbering b r 2 4 g 3 2 x x x - 3 a x x x x x lineup capacity package orderable part number remark type quantity 32k dip-t8 tube of 2000 br24g32 -3a not halogen free 100% sn sop8 reel of 2500 br24g32f -3agte2 halogen free 100% sn sop-j8m reel of 2500 br24g32fj -3ane2 halogen free 100% sn sop-j8 reel of 2500 br24g32fj -3agte2 halogen free 100% sn ssop-b8 reel of 2500 br24g32fv -3agte2 halogen free 100% sn tssop-b8 reel of 3000 br24g32fvt -3age2 halogen free 100% sn tssop-b8m reel of 3000 br24g32fvt -3ane2 halogen free 100% sn tssop-b8j reel of 2500 br24g32fvj -3agte2 halogen free 100% sn msop8 reel of 3000 br24g32fvm -3agttr halogen free 100% sn vson008x2030 reel of 4000 br24g32nux -3attr halogen free 100% sn bus type 24 : i 2 c operating temperature / operating voltage -40 to +85 / 1.7v to 5.5v capacity 32=32k process code revision g : halogen free blank : not halogen free as an exception, sop-j8m, tssop-b8m, vson008x2030 package will be halogen free with blank t : 100% sn blank : 100% sn packaging and forming specification e2 : embossed tape and reel (sop8, sop-j8m, sop-j8, tssop-b8, tssop-b8m, tssop-b8j) tr : embossed tape and reel (msop8, vson008x2030) none : tube (dip-t8) n : sop-j8m, tssop-b8m blank : dip-t8, sop8, sop-j8, ssop-b8, tssop-b8, tssop-b8j, msop8, vson008x2030 package blank f fv fvj nux : dip-t8 : sop8 : ssop-b8 : tssop-b8j : vson008x2030 fj fvt fvm : sop-j8m/sop-j8 : tssop-b8/tssop-b8m : msop8 downloaded from: http:///
26/37 datasheet d a t a s h e e t br24g32-3a ?2014 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 tsz02201-0r2r0g100050-1-2 18.may.2016 rev.007 physical dimension, tape and reel information package name dip-t8 ? order quantity needs to be multiple of the minimum quantity. tube containerquantity direction of feed 2000pcs direction of products is fixed in a container tube downloaded from: http:///
27/37 datasheet d a t a s h e e t br24g32-3a ?2014 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 tsz02201-0r2r0g100050-1-2 18.may.2016 rev.007 physical dimension, tape and reel information package name sop8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin (unit : mm) pkg : sop8 drawing no. : ex112-5001-1 (max 5.35 (include.burr)) downloaded from: http:///
28/37 datasheet d a t a s h e e t br24g32-3a ?2014 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 tsz02201-0r2r0g100050-1-2 18.may.2016 rev.007 physical dimension, tape and reel information package name sop-j8m ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin downloaded from: http:///
29/37 datasheet d a t a s h e e t br24g32-3a ?2014 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 tsz02201-0r2r0g100050-1-2 18.may.2016 rev.007 physical dimension, tape and reel information package name sop-j8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin downloaded from: http:///
30/37 datasheet d a t a s h e e t br24g32-3a ?2014 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 tsz02201-0r2r0g100050-1-2 18.may.2016 rev.007 physical dimension, tape and reel information package name ssop-b8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin downloaded from: http:///
31/37 datasheet d a t a s h e e t br24g32-3a ?2014 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 tsz02201-0r2r0g100050-1-2 18.may.2016 rev.007 physical dimension, tape and reel information package name tssop-b8 direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs e2 () 1pin downloaded from: http:///
32/37 datasheet d a t a s h e e t br24g32-3a ?2014 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 tsz02201-0r2r0g100050-1-2 18.may.2016 rev.007 physical dimension, tape and reel information package name tssop-b8m direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs e2 () 1pin downloaded from: http:///
33/37 datasheet d a t a s h e e t br24g32-3a ?2014 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 tsz02201-0r2r0g100050-1-2 18.may.2016 rev.007 physical dimension, tape and reel information package name tssop-b8j direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () 1pin downloaded from: http:///
34/37 datasheet d a t a s h e e t br24g32-3a ?2014 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 tsz02201-0r2r0g100050-1-2 18.may.2016 rev.007 physical dimension, tape and reel information package name msop8 direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs tr () 1pin downloaded from: http:///
35/37 datasheet d a t a s h e e t br24g32-3a ?2014 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 tsz02201-0r2r0g100050-1-2 18.may.2016 rev.007 physical dimension tape and reel information package name vson008x2030 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 4000pcs tr () direction of feed reel 1pin downloaded from: http:///
36/37 datasheet d a t a s h e e t br24g32-3a ?2014 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 tsz02201-0r2r0g100050-1-2 18.may.2016 rev.007 marking diagrams (top view) sop8 (top view) 4g32a part number marking lot numbe r 1pin mark sop-j 8(top view) 4g32a part number marking lot number 1pin mark tssop-b8j (top view) 2a3 part number marking lot numbe r 1pin mark 4g3 tssop-b8 (top view) 4g32a part number marking lot numbe r 1pin mark ssop-b8 (top view) 4gfa part number marking lot number 1pin mark dip-t8 (top view) br24g32a part number marking lot number sop-j 8m(top view) 4g32a part number marking lot number 1pin mark tssop-b8m (top view) 4g32 a part number marking lot number 1pin mark downloaded from: http:///
37/37 datasheet d a t a s h e e t br24g32-3a ?2014 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 tsz02201-0r2r0g100050-1-2 18.may.2016 rev.007 revision history date revision changes 15.may.2012 001 new release 25.feb.2013 002 update some english words, sentences descriptions, grammar and formatting. 29.mar.2013 003 p.5 - add directions in pin descriptions 1.may.2013 004 p.2- add vesd in absolute maximum ratings 27.aug.2014 005 p.1 change format of package line-up table. p.3 modified tsu:sta (0.25->0.20) p.24 update part numbering. add lineup table 27.oct.2014 006 add sop-j8m,tssop-b8m package p1.add 32kbit to a general description p1.add up to 32 byte in page write mode p1.add bit format 4k x 8 p1. list of models deletion p2. change the unit of power dissipation to w p22. change the operational notes change notice to rev003 18.may.2016 007 update japanese version vson008x2030 (top view) 2a3 part number marking lot number 1pin mark 4g3 msop8 (top view) 4gf part number marking lot number 1pin mark a downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufactured for application in o rdinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely h igh reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power c ontrollers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in adva nce. unless otherwise agreed in writing by rohm in advance, rohm s hall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arisin g from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific applic ations japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to stric t quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequ ate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified be low. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from th e use of any rohms products under any special or extraordinary environments or conditions. if yo u intend to use our products under any special or extraordinary environments or conditions (as exemplified belo w), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be n ecessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are ex posed to direct sunlight or dust [c] use of our products in places where the products are exp osed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even i f you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or moun ted products in using the products. 6 . in particular, if a transient load (a large amount of load appli ed in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board moun ting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affect product performance and reliability. 7 . de -rate power dissipation depending on ambient temperature. whe n used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range descri bed in the product specification. 9 . rohm shall not be in any way responsible or liable for f ailure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect produ ct performance and reliability. 2. in principle, the reflow soldering method must be used o n a surface-mount products, the flow soldering method must be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts , please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, p lease allow a sufficient margin considering variations o f the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and a ssociated data and information contained in this docum ent are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take pr oper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate i f the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderabil ity of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indi cated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a c arton. 4. use products within the specified time after opening a humi dity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label a two-dimensional barcode printed on rohm products label is f or rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to appl ication example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, a ctions or demands arising from the combination of the products with other articles such as components, circuits, systems or ex ternal equipment (including software). 3. no license, expressly or implied, is granted hereby under any inte llectual property rights or other rights of rohm or any third parties with respect to the products or the information contai ned in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or you r customers to the extent necessary to manufacture or sell products containing the products, subject to th e terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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